Mixed Signal CMOS Platform

For Digital, Analog, RF and Automotive Applications

We provide a wide range of logic compatible mixed-signal/CMOS manufacturing platforms for digital analog and RF applications including mainstream wireless, wireline communication, automotive and ultra low leakage applications. With our CMOS offering, we support designers who are seeking volume production from 1 um to 0.18, 0.16, and 0.13μm with additional higher density nodes on the roadmap. Decades of mature mixed signal and CMOS technology expertise, state of the art accurate models and design kit enable our customers to hit record of first time design to working silicon success.

Our engineering team continuously focuses on developing customized technology platforms and our unique ability to modify the process in a very short time allows us to meet our customers' aggressive timelines.

Our mixed-signal/CMOS offering includes:

• Powerfull set of design kits – resulting shorten design and simulation time
• Unmatched accurate models combined with comprehensive DFM tool:
  • First time success
  • Highest possible yield
• A large variety of devices
• Super density capacitors
• Ultra-thick single or double Cu layers for
  • low resistance inductors resulting 70% higher Q factor
  • driving high current
• Variety of Vt options from veru high speed to ultra low leakage at all platforms
• Design free macros for shrinking from 018 to 016 while maintaining accurate analog performance
• Comprehensive analog IP portfolio including:
  • std cells for very high speed and ultra low leakage
  • Variety of memory compilers
  • GPIO and POL
  • NVM – OTP and MTP
  • Analog IP – PLLs, ADC, DAC and more
• Quality and reliability spec to meet automotive reliability standards (TS16949)